1. Gold 4N bonding wireFor the outstanding chemical and mechanical properties, pure gold bonding wire is a ideal material connecting chip to substrate, is one of the key materials in semiconductor encapsulation industry. Over 13 years experience, strict and standard production procedure, 100 class purification workshop, Gpilot guarantees the...

1. High Purity 99.99% Gold Bonding Wire:Gpilot’s 4N 99.99 gold bonding wire with excellent electrical conductivity and chemical stability, good squashed ball shape and bondability, suitable breaking load and elongation -- the best choice of packaging material to the semiconductor industry.2. Mechanical Properties3. Download certificategold...

1. 80% High Content Gold Bonding Wire:Gold bonding wire with excellent electrical conductivity and chemical stability, good squashed ball shape and bondability, suitable breaking load and elongation. Special bonding wire is a kind of new wire Gpilot developed for customers to reduce the cost while keeping the gold bonding wire’s outstanding...

1. 60% Gold Content Bonding Wire:Pure gold bonding wire enjoys the perfect mechanical and chemical properties for bonding, but the cost is high. 60% Gold content bonding wire is composed of 60% Au and 40% Ag, Gpilot trys to keep the good performance of the gold wire as much as possible but reducing the cost for our customers.2. Mechanical...

1. Silver Alloy Bonding WireSilver alloy bonding wire as an alternative to gold wire, it has been useful to eliminate the drawbacks of silver wire and has the similar wire bonding properties to gold wire. Considering its low cost and highly reliable performance, silver alloy wire will be more popular and widely used in packaging industry.2....

1. Mixed Au and Ag Alloy Bonding WireConsidering its low cost and highly reliable performance which has the similar wire bonding properties to gold wire, silver alloy wire is more and more popular and widely used in packaging industry.Gpilot has two kinds of silver alloy bonding wire -- Au Coated Ag Alloy Bonding Wire and Mixed Au & Ag Alloy...

Pure Silver Bonding Wire:As an economical alternative of gold bonding wire,Website:http://www.gpilot-bondingwire.com, pure silver wire shares the similar propertiets to gold wire and is softer than copper-based wires which is especially suitable for fragile bond pad structures. Now is mainly used for LED encapsulation.2. Mechanical...

1. Silver Ag Bonding Wire:Silver bonding wire offers great cost advantage but the similar electrical conductivity and properties to gold bonding wire,Website:http://www.gpilot-bondingwire.com, lower risk of bond pad metal cracking, all these benefits attracted high attention as a solution of the replacement of gold wire.2. Mechanical...

1. Copper Bonding WireCopper bonding wire is used as a material connecting a silicon die to the package terminals in semiconductor encapsulation. As the increasing of the gold expense,Website:http://www.gpilot-bondingwire.com, copper bonding wire enjoys great cost advantage over gold wire. Additionally, due to the stable chemical properties and...

1. Palladium Coated Copper Bonding WireBecause of the noble metal protection,Website:http://www.gpilot-bondingwire.com, palladium coated copper bonding wire provides better corrosion protection of the copper core of the wire and improvement in reliability. 2. Mechanical Properties3. Physical Properties 4....